30.0
lid top (15 mm blank)
28.0
lid ceiling, 2 mm roof (1.2 mm over the RJ45)
19.3
RF compartment ceiling = heatsink face on the modules
15.0
lid split face = board top = SMA axis
14.8
base split face, 0.2 mm clamp seam
13.4
board bottom on ledge + screw bosses
9.9
cavity floor (THT pins reach 10.7)
0
base underside, screw heads recessed
The lid's split face is one flat plane: walls, RF fences and bosses all press on the board. The base face sits 0.2 mm lower, so the screws always clamp the board, whatever the PCB tolerance (±10 %).